30 khz-20 ghz gaas mmic optical modulator driver amplifier page 1 of 2 mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2006 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. cmm3020-bd august 2006 - rev 02-aug-06 features small size: 43 x 92 mils high gain: 10 db typical output voltage up to 7.5 v peak-to-peak 30 khz to 20 ghz bandwidth low gain ripple: 1.0 db pp typical sub 0.25 micron ion/implant process applications driver for linb0 3 modulator @ oc192 bit rate sonet/shd transmission systems medium power linear gain block for broadband systems description the cmm3020-bd is a precision gaas mmic, medium power amplifier and is part of celeritek?s family of widefiber? products. the cmm3020-bd optical driver amplifier gives fiber optic system designers a unique combination of wideband frequency coverage, along with a flat response and very low internal jitter. it is a precision ion/implanted gaas rf ic medi- um power amplifier with +23 dbm @ p1db (typ). it operates from 30 khz to 20 ghz with a 10 db linear gain. low internal jitter makes it especially well suited for high speed digital data applications. typical output voltage is 7.5 v peak-to-peak. it is an excellent choice for driving lithium niobate external optical modulators, where a high extinction ratio is necessary. targeted for oc-192 and other high speed applica- tions, the bit rate can be as high as 15 gb/s. the bias voltage can be adjusted to reduce the output voltage as needed. cmm3020-bd amplifiers are shipped in gel pack from celeritek?s foundry. chip diagram specifications (t a = 25c, v dd = 8v) x a m p y t n i m s t i n u s r e t e m a r a p z h g 0 . 0 2 z h k 0 3 ? e g n a r y c n e u q e r f 0 . 0 1 0 . 9 b d n i a g l a n g i s l l a m s 5 7 . 0 5 . 0 b d s s e n t a l f n i a g 1 : 0 . 2 1 : 8 . 1 ? r w s v t u p t u o / t u p n i power output (@1 db gain compression) dbm 22.0 23.0 0 . 0 4 m b d t n i o p t p e c r e t n i r e d r o d n o c e s 0 . 0 3 m b d t n i o p t p e c r e t n i r e d r o d r i h t 5 7 2 5 2 2 a m t n e r r u c units in microns
30 khz-20 ghz gaas mmic optical modulator driver amplifier page 2 of 2 mimix broadband, inc., 10795 rockley rd., houston, texas 77099 tel: 281.988.4600 fax: 281.988.4615 mimixbroadband.com characteristic data and specifications are subject to change without notice. ? 2006 mimix broadband, inc. export of this item may require appropriate export licensing from the u.s. government. in purchasing these parts, u.s. domestic customers accept their obligation to be compliant with u.s. export laws. cmm3020-bd august 2006 - rev 02-aug-06 ordering information part number for ordering s ystem application/description 6 1 - m t s / 8 4 - c o 8 4 0 0 - d b - 0 2 0 3 m m c 4 6 - m t s / 2 9 1 - c o 2 9 1 0 - d b - 0 2 0 3 m m c absolute maximum ratings g n i t a r r e t e m a r a p v 2 1 e g a t l o v n i a r d v 5 - e g a t l o v e t a g a m 0 5 3 t n e r r u c n i a r d continuous power dissipation 3.0 w channel temperature +175c storage temperature -65c to +175c mounting temperature +320c m b d 3 2 + r e w o p t u p n i die attach and bonding procedures die attach: eutectic die attach is recommended. for eutec- tic die attach: preform: ausn (80% au, 20% sn); stage temperature: 290c, 5c; handling tool: tweezers; time: 1 min or less. wire bonding: wire size: 0.7 to 1.0 mil in diameter (pre- stressed); thermocompression bonding is preferred over thermosonic bonding. for thermocompression bonding: stage temperature: 250c; bond tip temperature: 150c; bonding tip pressure: 18 to 40 gms depending on size of wire. schematic diagram
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